Inside Speakers Info: Author Timeline l Abstract Submission l Preparing Final Manuscripts (coming soon) l Preparing Presentation (coming soon) 

Abstract submission for IRPS 2025

IRPS offers its attendees technical sessions, tutorials, workshops, a year-in-review seminar and a poster session, all covering state-of-the-art developments in the reliability physics of electronic and optoelectronic devices, materials, and systems. Attendees returning from the IRPS will be better equipped to solve critical reliability problems and develop effective qualification procedures that affect their companies’ bottom line.

To submit your 2-page abstract, follow these instructions:

1. Download the Abstract Writing Guide HERE.

2. Download the Abstract Template HERE.

3. Download an Example Abstract HERE.

4. Upload your two-page abstract to the Abstract Submission Site HERE.

Abstracts are due by 11:59 PM PDT on October 13 October 20, 2024 (extended!). All abstracts must be submitted electronically on Ex Ordo web site (https://irps2025.exordo.com/). Only pdf file format can be accepted. Abstracts exceeding two pages in length will not be accepted; the paper size must be either 8.5″ x 11″ (Letter) or A4. The minimum allowable font size is 10 point Times New Roman or 11 point Calibri. Abstracts typically contain one page of text and one page of figures. The work described in your abstract must be original. The abstract should highlight the novelty of the work and place it in the context of previous works. Specific results (e.g. data or model equations) must be provided to demonstrate that the work is complete and to allow for the outcomes to be evaluated. Following abstract review, full manuscripts of accepted papers will be due before the conference.

Authors will be notified of acceptance status by the middle of December.

Late-news submission for IRPS

Full-length manuscripts with late-breaking news may be considered for inclusion in the conference/proceedings starting January 3, 2025. These are due by January 23, 2025.

YOUR ORIGINAL PAPERS AND POSTERS ARE SOLICITED, which:

• Identify new or improve our understanding of the physics of failure and modeling of mechanisms in electronic and optoelectronic devices, materials, and systems;

• Identify how fabrication processes influence the susceptibility of product to particular physical failure mechanisms;

• Quantify the impact of device and circuit design, as well as material and process selection on reliability;

• Present new, innovative, or improved failure analysis techniques;

• Describe reliability testing/stressing, qualification, and screening methodologies or strategies for materials, devices, circuits, or chips; either at wafer- or module-level for commercial or “extreme” environments;

• Demonstrate techniques to build-in or extend reliability while meeting performance goals, especially as technologies are scaled.

Upload your late-news paper to the Submission Site HERE